这些小活动你都参加了吗?快来围观一下吧!>>
电子产品世界 » 论坛首页 » 企业专区 » ADI » 【技术应用笔记】引脚架构芯片级封装(LFCSP)设计与制造指南

共1条 1/1 1 跳转至

【技术应用笔记】引脚架构芯片级封装(LFCSP)设计与制造指南

高工
2012-04-03 22:11:49     打赏

简介:本文详细讲解了引脚架构芯片级封装(LFCSP)设计与制造指南

ADI资深工程师宝贵经验!

2. Application Notes for Surface Mount Assembly of
Amkor’s Microleadframe (MLF) Packages, September
2002
3. Electrical Report from Amkor Technology:
7.0mm37.0mm31.4mm, 48 Lead LQFP, 3D Electrical
Parasitic Parameters (Report EM-99-19), February 1999
4. Electrical Report from Amkor Technology:
7.0mm37.0mm30.9mm 48 Lead MLP2, 3D Electrical
Parasitic Parameters (Report EM-99-03), February 1999
5. Electrical Report from Amkor Technology:
3.0mm33.0mm30.9mm 8 Lead TSSOP, 3D Electrical
Parasitic Parameters (Report EM-98-57), October 1998
6. Electrical Report from Amkor Technology: 3.0mm 
32.0mm 30.85mm 8 Lead MLF, 3D Electrical Parasitic
Parameters (Report EM-2000-011), July 2000
7. Reliability Report from Analog Devices: Evaluation of
Reliability of SnPb and SnAgCu Solder Joints In 737mm
LFCSP Package, March 2003 

AN-772:引脚架构芯片级封装(LFCSP)设计与制造指南.pdf




关键词: 技术应用     笔记     引脚     架构     芯片     封装     LFCSP    

共1条 1/1 1 跳转至

回复

匿名不能发帖!请先 [ 登陆 注册 ]