【应用手册】Thermal Management and Mechanical Handling for Altera FCmBGA Devices
This application note describes the thermal composite flip chip molded ball-grid array
(FCmBGA) package for the Arria V device family.
FCmBGA improves board real-estate use by allowing closer spacing between passive
components and the flip chip die, providing better warpage control for thin core
substrates, and improving solder joint reliability.an657.pdf