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简介：本文详细讲解了引脚架构芯片级封装（LFCSP）设计与制造指南

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2. Application Notes for Surface Mount Assembly of
Amkor’s Microleadframe (MLF) Packages, September
2002
3. Electrical Report from Amkor Technology:
7.0mm37.0mm31.4mm, 48 Lead LQFP, 3D Electrical
Parasitic Parameters (Report EM-99-19), February 1999
4. Electrical Report from Amkor Technology:
7.0mm37.0mm30.9mm 48 Lead MLP2, 3D Electrical
Parasitic Parameters (Report EM-99-03), February 1999
5. Electrical Report from Amkor Technology:
3.0mm33.0mm30.9mm 8 Lead TSSOP, 3D Electrical
Parasitic Parameters (Report EM-98-57), October 1998
6. Electrical Report from Amkor Technology: 3.0mm 
32.0mm 30.85mm 8 Lead MLF, 3D Electrical Parasitic
Parameters (Report EM-2000-011), July 2000
7. Reliability Report from Analog Devices: Evaluation of
Reliability of SnPb and SnAgCu Solder Joints In 737mm
LFCSP Package, March 2003 

AN-772：引脚架构芯片级封装（LFCSP）设计与制造指南.pdf