【应用笔记】使用Altera的高密度BGA封装器件进行设计(Designing With High-Density BGA Packages for Altera Devices)
As programmable logic devices (PLDs) increase in density and I/O pins,
the demand for small packages and diverse packaging options continues
to grow. Ball-grid array (BGA) packages are an ideal solution because the
I/O connections are on the interior of the device, improving the ratio
between pin count and board area. Typical BGA packages contain up to
twice as many connections as quad flat pack (QFP) packages for the same
area. Further, BGA solder balls are considerably stronger than QFP leads,
resulting in robust packages that can tolerate rough handling.
Altera has developed high-density BGA solutions for users of
high-density PLDs. These new formats require less than half the board
space of standard BGA packages.an114.pdf