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MNC， 深圳 新team，汇报线美国，招聘如下职位,主要是指纹识别芯片，可以考虑MEMS类似的这种想过产品线的。薪资 30 - 70w之间，基本8y+相关经验人合适再谈。


CV to mp0118@manpower.com.cn


Paladin Job Recruit Plan 1st Wave :  
Image Processing and Algorithm Researcher 


Manager, Product Integration and Test Engineering 
Process Researcher, Roll-to-Roll Process Integration and Lithography 
Process Researcher, Roll-to-Roll Physical Vapor Deposition and Etch
Assembly (Packaging) Manufacturing Engineer 
Production Test Engineering Engineer 


 
Image Processing and Algorithm Researcher


Reports to: Manager, Software Team Leader,


Position Description:
Design, and implement image processing, image analysis, defect correction and fingerprint  minutiae pattern extract, pattern matching algorithms on PC based and mobile platforms.
Develop performance models and test parameters for fingerprint matching algorithms.
Design test schemes and test methodologies for benchmarking of algorithms.
Support application software and embedded implementation of algorithms into multiple host platforms.


Required Skills:


Extensive experience in image collection, image processing and pattern matching analysis – specifically in fingerprint biometrics.
Excellent working knowledge of fingerprint template creation and matching schemes.
Extensive familiarity with ANSI and FIPS standards for templates.
Deep understanding of embedded microprocessors, and porting of algorithms to microprocessors in various cores, including ARM and DSP.
Experience in development of test schemes to benchmark fingerprint algorithm matching performance.
Experience with system level optimization of sensor, hardware and matching algorithm to maximize overall performance of system while maintaining excellent matching reliability
Strong troubleshooting skills.
Qualifications


- Master Degree or Above in Computer Science or Electrical Engineering
- 10+ years relevant experience in design and implementation of fingerprint image processing and template matching schemes for PC and embedded applications
- Organized, hands-on engineer, capable of working independently without daily supervision
 Integrity,creative & likes to invent,optimize and improve.
 Good verbal and written communication skill in English.
 Willing to do travel overseas.
 Good communication interface & team work.
 Experience in working with cross functional teams to implement dynamic changes in timely manner to satisfy customer needs.
 Location
ShenZhen,China.
















Manager, Product Integration and Test Engineering 


Reports to: Device Engineering Senior Manager, Manager


Position Description


• Hands-on management of a group responsible for Product Engineering, Test and Quality Engineering for thin film based flexible fingerprint user interface devices and hardware modules for integration into cell phones, PCs, smart cards, automobiles, etc.


Job responsibilities include:


o Hands-on Management of a group responsible for 
• Product Engineering functions, including performance specification development, assessment of product performance against specifications, yield analysis, tracking and reporting, customer integration engineering support, and interface with internal Product Marketing and Systems Engineering groups for product optimization.
• Extensive test methodology development, testing, analysis, reporting and tracking of patterned thin film based sensors, assemblies and products;
• Working closely with customers to ensure successful integration of sensor product into customer platform, and improve sensor products to meet specifications and requirements;
• Work closely with and manage algorithm development functions to tightly interweave and integrated algorithm and sensor for optimal performance, yield, quality and speed
• Extensive optimization relating to sensors, assemblies, electrical hardware module and firmware / software associated with module;
• Test development for compliance against specification, and also production test development for ongoing compliance of product against specifications
• Significant interface with customers to provide performance capability and variance reporting, field failure analysis and corrective action tracking and reporting;
• Working in a team environment to determine and improve product and material related issues; implement into a production environment
• Solid understanding of material, component and product analysis using traditional analytical and other techniques;


o Ability to multi-task various projects and manage resources efficiently and effectively
o Providing schedule input and communicating status to various levels of management, peers and team members
o Solid project management experience with goal definition, planning, scheduling and status communication to various levels of management, peers and team members;
o Experience with or ability to grasp flexible polymer based processing methods, architectures, etc;
o Working under extremely tight deadlines and high pressure situations to deliver against commitments


Education
 MS or Ph. D. in ME, CE, or Materials Engineering, EE or Physics or equivalent. Higher degrees a plus.
Qualifications
• Extensive experience in product engineering, product integration, test development and optimization of electronic components, sub-assemblies and systems
• Ability and willingness to be a hands-on manager; involved in all details of engineering and quality
• Extensive experience in performance specification development and testing of components for cell phones, PCs, smart cards, and automotive applications
• Working knowledge of semiconductor or thin film device manufacturing processing such as photolithography, vacuum depositions, plating, wet and dry etching, packaging, etc.
• Knowledge of and familiarity with thin film processing of flexible substrates is a plus 
• Detailed experience with ASIC testing, failure modes and mechanisms, and quality systems involving the same
• Working knowledge of and experience with test systems for thin film based devices for product analysis;
• Strong project management skills required along with ability to take ownership of projects; communicate with vendors, customers and management
• Strong customer interfacing skills with experience in taking a lead in customer product related issues
• Highly technical, hands-on approach required with deep commitment to meeting schedules under high pressure situations
• Strong ability to plan, coordinate, report and communicate at all levels within and outside the organization.
• Integrity, creative & likes to invent,optimize and improve.
• Good verbal and written communication skill in English.
• Willing to do travel overseas.
• Experience in working with cross functional teams to implement dynamic changes in timely manner to satisfy customer needs.
 
Experience


• Experience with electronic component testing for PC, cell phone, smart card and automotive applications
• 15 years minimum industry and management experience in design, product and reliability engineering and quality systems implementation for MEMS, semiconductor or other thin film devices on various substrates, in high volume environments.
• Proven experience in being a hands-on team leader, with excellent communication skills 


Location
Shenzhen,China 








 
- Process Researcher, Roll-to-Roll Process Integration and Lithography 


Reports to:  Manager, Fabrication Process


Position Description: Work closely with contract partners for the implementation of polymer coatings and lithographic patterning processes on flexible plastic substrate that enable fine pitch reel-reel or roll-roll circuit electrode array fabrication


Roles & Responsibilities:
• Work in conjunction with development team and contract manufacturing partner to 
o Implement formulation of organic coating on polyimide substrate
o implement uniform coating process, such as spin, blade, sol-gel, or extrusion coating, of applying thick organic coating on polyimide substrate
o Implement uniform lithographic patterning process, such as contact or proximity print, on polyimide substrate
o Execute improvements to existing process modules to deliver required process capacity, capability and cost. 
o Monitor and support line quality and maintain high yields
o Specify, evaluate, select, and commission roll-to-roll equipment. Champion new process technology modules in large-area web coating and lithography from definition to implementation in volume manufacturing.  Validate new modules and optimize for high Cpk
• Work in a team environment to determine and improve product and material related issues
• Working under extremely tight deadlines and high pressure situations to deliver against commitments


Education & Desired Experience:
• MS or PhD in Polymer Science, Chemistry, Chemical, or Materials Engineering preferred
• 10+years post-undergraduate experience with hands-on material and process development and engineering both in a mass production environment in semiconductor, solar, display, MEMS, or drug industry
• Experience with roll-to-roll (web) manufacturing of flexible circuits, photovoltaic cells, OLED, or MEMS devices, a plus
• Methodical approach to process development with depth in data analysis associate with SPC, DOE, pFMEA, fishbone analysis.  Experience with relevant software tools such as JMP, Minitab
• Proven experience in being a hands-on team player, with excellent communication skills 
• Process development at vendor facilities a plus


Qualifications:
 Integrity,creative & likes to invent,optimize and improve.
 Good verbal and written communication skill in English.
 Willing to do travel overseas.
 Good communication interface & team work.
 Experience in working with cross functional teams to implement dynamic changes in timely manner to satisfy customer needs.


Location
• Shenzhen,China


 
 






Process Researcher, Roll-to-Roll Physical Vapor Deposition and Etch


Reports to: Manager, Fabrication Process


Position Description: Work closely with development team contract partners for the implementation of deposition and wet/dry etching process of multi-layer metals and semiconductors on flexible plastic substrate that enable circuit electrode array fabrication


Role & Responsibilities:
• Work in conjunction with development team and contract manufacturing partner to 
o Implement glue metal and electrode metal layers on polyimide substrate
o Implement semiconducting sensor materials on polyimide substrate
o Implement uniform and sequential physical vapor deposition process, such as sputtering, ion beam, or e-beam, of applying multi-layers of metals and semiconductors on polyimide substrate
o Implement uniform and sequential wet/dry etching process, such as acid etch of metals and plasma etch of semiconductors, on polyimide substrate
o Execute improvements to existing process modules to deliver required process capacity, capability and cost. 
o Monitor and support line quality and maintain high yields
o Specify, evaluate, select, and commission roll-to-roll equipment. Champion new process technology modules in large-area web deposition and wet/dry etch from definition to implementation in volume manufacturing.  Validate new modules and optimize for high Cpk
• Work in a team environment to determine and improve product and material related issues
• Working under extremely tight deadlines and high pressure situations to deliver against commitments


Education & Desired Experience:
• MS or PhD in Physics, Chemistry, Chemical, Mechanical, or Materials Engineering preferred
• 10+years post-undergraduate experience with hands-on material and process development and engineering both in a mass production environment in semiconductor, solar, display, thin film electronics, or MEMS industry
• Experience with roll-to-roll (web) manufacturing of flexible circuits, photovoltaic cells, OLED, or MEMS devices, a plus
• Methodical approach to process development with depth in data analysis associate with SPC, DOE, pFMEA, fishbone analysis.  Experience with relevant software tools such as JMP, Minitab
• Proven experience in being a hands-on team player, with excellent communication skills 
• Process development at vendor facilities a plus


Qualifications:
 Integrity,creative & likes to invent,optimize and improve.
 Good verbal and written communication skill in English.
 Willing to do travel overseas.
 Good communication interface & team work.
 Experience in working with cross functional teams to implement dynamic changes in timely manner to satisfy customer needs.


Location
• Shenzhen,China












 
Assembly (Packaging) Manufacturing Engineer


Reports to: Manager, Fabrication Process


Position Description:
• Work closely with development team and contract partners to develop tooling, processes and automation for high volume assembly of MEMS sensor products.
• Work with outside contract manufacturing partners to develop and manage partnerships for key processing steps.
• Participate in improvement of existing product and development of future products.
• Job requires ability to plan, and consistently deliver against plan on development and release to production milestones.


Job responsibilities include:
• Work closely with development team and contract partners to set up low cost, high volume manufacturing capability for micron level precision assembly of flexible structures on plastic and glass substrates.
• Tooling and equipment acquisition, process development, training and process control.
• Develop and manage roll to roll conversion processing at external vendors.
• Develop and execute yield ramp plan.
• Develop and execute throughput improvement plan.
• Work under extremely tight deadlines and high pressure situations to deliver against commitments.
Education:
 BS in Mechanical Engineering or equivalent.
Qualifications:
 Experience with adhesives including PSA’s, Epoxies and hot melt adhesives.  ACF a plus.
 Experience in assembling products with micron scale alignment requirements.  
 Roll to Roll Conversion and processing experience. 
 Skilled with Solidworks.  Conversant with Autocad.
 Experienced in partnering with outside suppliers and services.
 Experience in bringing a product from prototype to pilot production.
 Ability to work in a multinational team environment 
 Integrity,creative & likes to invent,optimize and improve.
 Good verbal and written communication skill in English.
 Willing to do travel overseas.
 Good communication interface & team work.
 Experience in working with cross functional teams to implement dynamic changes in timely manner to satisfy customer needs.


Experience:
• 10+ Years industry experience in precision assembly/packaging of small flexible components.
• 3 years experience with roll to roll processing and conversion.
• Ability to design and build tooling.
• Familiarity with fabrication of microelectronic components (semiconductor and MEMS devices) is a plus.
Location
• Shenzhen,China
 












Production Test Engineering Engineer


Reports to: Manager, Fabrication Process


Position Description


• Hands-on implementation of hardware and software needed for high volume production final test of thin film fingerprint sensors - including throughput improvement, development of metrics, database management, yield reporting and optimization.


Job responsibilities include:


o Work closely with the development group and outside equipment vendors for 
• Detailed documentation of final product specifications; assurance of test methods to test against required specifications and implementation of final test
• Extensive test methodology development and implementation for final test, including throughput requirements, test metrics, pass / fail and other binning criteria and implementation; parameter sensitivity analysis; optimization of test functions with product performance 
• Yield analysis, tracking and reporting, customer integration engineering support, and interface with internal Product Marketing and Systems Engineering groups for product optimization.
• Work closely with algorithm development team to tightly interweave and integrated algorithm and sensor for optimal performance, yield, quality and speed
• Extensive optimization relating to sensors, assemblies, electrical hardware module and firmware / software associated with module;
• Development of appropriate databases and schemes to store, retrieve and parse appropriate final test data for tracking, analysis and improvement
• Extensive focus on the throughput / test efficiency tradeoff; 
• Use statistical methods to define and determine audit testing and implementation
• Significant interface with customers to provide performance capability and variance reporting, field failure analysis and corrective action tracking and reporting;
• Working in a team environment to determine and improve product and material related issues; implement into a production environment
• Solid understanding of material, component and product analysis using traditional analytical and other techniques;


o Ability to multi-task various projects and manage resources efficiently and effectively
o Providing schedule input and communicating status to various levels of management, peers and team members
o Solid project management experience with goal definition, planning, scheduling and status communication to various levels of management, peers and team members;
o Experience with or ability to grasp flexible polymer based processing methods, architectures, etc;
o Working under extremely tight deadlines and high pressure situations to deliver against commitments


Education


 MS in ME, CE, or Materials Engineering, EE or Physics or equivalent. Higher degrees a plus.


Qualifications


• Extensive experience in production test development, product engineering, product integration, test development and optimization of electronic components, sub-assemblies and systems
• Ability and willingness to be a hands-on engineer; involved in all details of the testing of the product
• Extensive experience in performance specification development and testing of components for cell phones, PCs, smart cards, and automotive applications
• Working knowledge of semiconductor or thin film device manufacturing processing such as photolithography, vacuum depositions, plating, wet and dry etching, packaging, etc.
• Knowledge of and familiarity with thin film processing of flexible substrates is a plus 
• Detailed experience with ASIC testing, failure modes and mechanisms, and quality systems involving the same
• Extremely strong background in production based final test systems for thin film based devices for product analysis;
• Strong project management skills required along with ability to take ownership of projects; communicate with vendors, customers and management
• Strong customer interfacing skills with experience in taking a lead in customer product related issues
• Highly technical, hands-on approach required with deep commitment to meeting schedules under high pressure situations
• Strong ability to plan, coordinate, report and communicate at all levels within and outside the organization. 
• Integrity,creative & likes to invent,optimize and improve.
• Good verbal and written communication skill in English.
• Willing to do travel overseas.
• Good communication interface & team work.
• Experience in working with cross functional teams to implement dynamic changes in timely manner to satisfy customer needs.
•
Experience
• Experience with electronic component testing for PC, cell phone, smart card and automotive applications
• 15 years minimum industry and management experience in design, product and reliability engineering and quality systems implementation for MEMS, semiconductor or other thin film devices on various substrates, in high volume environments.
• Proven experience in being a hands-on team player, with excellent communication skills 


Location


- Shenzhen, China