EEPW论坛

标准Packages 封装数据手册

封装分类

• BGA (Ball Grid Array)
  • CBGA (Ceramic)
  • FCBGA
  • PBGA (Plastic)
  • SBGA (w/Heatsink)
• CSP (Chip Scale Package)
  • CSP BGA (Ball Grid Array)
  • LFCSP (LeadFrame)
  • LGA (Land Grid Array)
  • Tape CSP BGA
  • WLCSP (Wafer Level)
• DIP (Dual Inline Package)
  • CerDIP (Ceramic)
  • CerDIP - Gullwing Leads
  • CerDIP - Side or Bottom Brazed
  • Metal or Hybrid DIP
  • PDIP (Plastic)
• FlatPack
  • Ceramic Flat Package
• Header
  • Modules
  • TO-92 (Plastic Header)
  • TO-XX (Metal Header)
• LCC (Leaded or Leadless Chip Carrier)
  • CLCC - Gullwing Leads
  • J leaded CLCC
  • LCC (Leadless Ceramic)
  • PLCC (Plastic, Leaded)
  • PLCC w/heat sink
• PGA (Pin Grid Array)
  • Ceramic Pin Grid Array
• QFP (Quad Flat Pack)
  • CQFP (Ceramic)
  • LQFP 1.4mm thick
  • LQFP w/heat sink
  • MQFP
  • MQFP - Thermally Enhanced
  • TQFP (Thin, 1.0mm)
  • TQFP - Thermally Enhanced
• SIP (Single Inline Package)
  • SIP Vertical Leads
  • y-10(202)
  • y-10(204)
  • y-15
  • y-4
  • ys-5
• SOIC (Small Outline IC)
  • PSOP (SOIC w/heatslug)
  • SOIC (Narrow)
  • SOIC (Wide)
• SOP (Small Outline Package)
  • MSOP (micro-SOIC)
  • QSOP (25mil pitch)
  • SSOP (Shrink SO)
  • Thermally Enhanced [PSOP/2]
  • TSSOP (Thin, 1.2mm)
  • TSSOP_EP
• SOT (Small Outline Transistor)
  • SC-70
  • SOT-143
  • SOT-223
  • SOT-23
  • SOT-66
  • SOT-89
  • TSOT-23 (Thin, 0.9mm)

       以上数据都是ADI公司提供的，基本涵盖了芯片封装大小，如用Protel画封装的话，可以参考以上的数据手册，当然要注意的是，以上尺寸是芯片的大小，如果是机器焊接的话（回流焊/波峰焊），版图的大小可以按照芯片管脚的大小设计。如果是人焊接的话，为了方便焊接，焊盘还是画大一点好。