摘要：
The DM816xx CYG package is designed with a new technology called a Via Channel™ array. This technology allows for easy routing of the device in two signal and two power layers using large through-hole via diameters and standard trace widths; it is cost and time effective. Where more than four printed circuit board (PCB) layers are used, the routing is much more open and flexible than a regular BGA. This application report shows how to route the entire package by showing each quadrant up close and explaining the PCB feature sizes used. For this document, the Allegro® layout tool was used, although any PCB layout tool can be used.
文档：sprabk6.pdf
链接：http://www.ti.com.cn/general/cn/docs/litabsmultiplefilelist.tsp?literatureNumber=sprabk6
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