一、综合词汇 1、印制电路:printedcircuit 2、印制线路:printedwiring 3、印制板:printedboard 4、印制板电路:printedcircuitboard(PCB) 5、印制线路板:printedwiringboard(PWB) 6、印制元件:printedcomponent 7、印制接点:printedcontact 8、印制板装配:printedboardassembly 9、板:board 10、单面印制板:single-sidedprintedboard(SSB) 11、双面印制板:double-sidedprintedboard(DSB) 12、多层印制板:mulitlayerprintedboard(MLB) 13、多层印制电路板:mulitlayerprintedcircuitboard 14、多层印制线路板:mulitlayerpritedwiringboard 15、刚性印制板:rigidprintedboard 16、刚性单面印制板:rigidsingle-sidedprintedborad 17、刚性双面印制板:rigiddouble-sidedprintedborad 18、刚性多层印制板:rigidmultilayerprintedboard 19、挠性多层印制板:flexiblemultilayerprintedboard 20、挠性印制板:flexibleprintedboard 21、挠性单面印制板:flexiblesingle-sidedprintedboard 22、挠性双面印制板:flexibledouble-sidedprintedboard 23、挠性印制电路:flexibleprintedcircuit(FPC) 24、挠性印制线路:flexibleprintedwiring 25、刚性印制板:flex-rigidprintedboard,rigid-flexprintedboard 26、刚性双面印制板:flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted 27、刚性多层印制板:flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard 28、齐平印制板:flushprintedboard 29、金属芯印制板:metalcoreprintedboard 30、金属基印制板:metalbaseprintedboard 31、多重布线印制板:mulit-wiringprintedboard 32、陶瓷印制板:ceramicsubstrateprintedboard 33、导电胶印制板:electroconductivepasteprintedboard 34、模塑电路板:moldedcircuitboard 35、模压印制板:stampedprintedwiringboard 36、顺序层压多层印制板:sequentially-laminatedmulitlayer 37、散线印制板:discretewiringboard 38、微线印制板:microwireboard 39、积层印制板:buile-upprintedboard 40、积层多层印制板:build-upmulitlayerprintedboard(BUM) 41、积层挠印制板:build-upflexibleprintedboard 42、表面层合电路板:surfacelaminarcircuit(SLC) 43、埋入凸块连印制板:B2itprintedboard 44、多层膜基板:multi-layeredfilmsubstrate(MFS) 45、层间全内导通多层印制板:ALIVHmultilayerprintedboard 46、载芯片板:chiponboard(COB) 47、埋电阻板:buriedresistanceboard 48、母板:motherboard 49、子板:daughterboard 50、背板:backplane 51、裸板:bareboard 52、键盘板夹心板:copper-invar-copperboard 53、动态挠性板:dynamicflexboard 54、静态挠性板:staticflexboard 55、可断拼板:break-awayplanel 56、电缆:cable 57、挠性扁平电缆:flexibleflatcable(FFC) 58、薄膜开关:membraneswitch 59、混合电路:hybridcircuit 60、厚膜:thickfilm 61、厚膜电路:thickfilmcircuit 62、薄膜:thinfilm 63、薄膜混合电路:thinfilmhybridcircuit 64、互连:interconnection 65、导线:conductortraceline 66、齐平导线:flushconductor 67、传输线:transmissionline 68、跨交:crossover 69、板边插头:edge-boardcontact 70、增强板:stiffener 71、基底:substrate 72、基板面:realestate 73、导线面:conductorside 74、元件面:componentside 75、焊接面:solderside 76、印制:printing 77、网格:grid 78、图形:pattern 79、导电图形:conductivepattern 80、非导电图形:non-conductivepattern 81、字符:legend 82、标志:mark 二、基材: 1、基材:basematerial 2、层压板:laminate 3、覆金属箔基材:metal-cladbadematerial 4、覆铜箔层压板:copper-cladlaminate(CCL) 5、单面覆铜箔层压板:single-sidedcopper-cladlaminate 6、双面覆铜箔层压板:double-sidedcopper-cladlaminate 7、复合层压板:compositelaminate 8、薄层压板:thinlaminate 9、金属芯覆铜箔层压板:metalcorecopper-cladlaminate 10、金属基覆铜层压板:metalbasecopper-cladlaminate 11、挠性覆铜箔绝缘薄膜:flexiblecopper-claddielectricfilm 12、基体材料:basismaterial 13、预浸材料:prepreg 14、粘结片:bondingsheet 15、预浸粘结片:preimpregnatedbondingsheer 16、环氧玻璃基板:epoxyglasssubstrate 17、加成法用层压板:laminateforadditiveprocess 18、预制内层覆箔板:masslaminationpanel 19、内层芯板:corematerial 20、催化板材:catalyzedboard,coatedcatalyzedlaminate 21、涂胶催化层压板:adhesive-coatedcatalyzedlaminate 22、涂胶无催层压板:adhesive-coateduncatalyzedlaminate 23、粘结层:bondinglayer 24、粘结膜:filmadhesive 25、涂胶粘剂绝缘薄膜:adhesivecoateddielectricfilm 26、无支撑胶粘剂膜:unsupportedadhesivefilm 27、覆盖层:coverlayer(coverlay) 28、增强板材:stiffenermaterial 29、铜箔面:copper-cladsurface 30、去铜箔面:foilremovalsurface 31、层压板面:uncladlaminatesurface 32、基膜面:basefilmsurface 33、胶粘剂面:adhesivefaec 34、原始光洁面:platefinish 35、粗面:mattfinish 36、纵向:lengthwisedirection 37、模向:crosswisedirection 38、剪切板:cuttosizepanel 39、酚醛纸质覆铜箔板:phenoliccellulosepapercopper-cladlaminates(phenolic/paperCCL) 40、环氧纸质覆铜箔板:epoxidecellulosepapercopper-cladlaminates(epoxy/paperCCL) 41、环氧玻璃布基覆铜箔板:epoxidewovenglassfabriccopper-cladlaminates 42、环氧玻璃布纸复合覆铜箔板:epoxidecellulosepapercore,glassclothsurfacescopper-cladlaminates 43、环氧玻璃布玻璃纤维复合覆铜箔板:epoxidenonwoven/wovenglassreinforcedcopper-cladlaminates 44、聚酯玻璃布覆铜箔板:ployesterwovenglassfabriccopper-cladlaminates 45、聚酰亚胺玻璃布覆铜箔板:polyimidewovenglassfabriccopper-cladlaminates 46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxidewovenglassfabriccopper-cladlamimates 47、环氧合成纤维布覆铜箔板:epoxidesyntheticfiberfabriccopper-cladlaminates 48、聚四乙烯玻璃纤维覆铜箔板:teflon/fiberglasscopper-cladlaminates 49、超薄型层压板:ultrathinlaminate 50、陶瓷基覆铜箔板:ceramicsbasecopper-cladlaminates 51、紫外线阻挡型覆铜箔板:UVblockingcopper-cladlaminates 三、基材的材料 1、A阶树脂:A-stageresin 2、B阶树脂:B-stageresin 3、C阶树脂:C-stageresin 4、环氧树脂:epoxyresin 5、酚醛树脂:phenolicresin 6、聚酯树脂:polyesterresin 7、聚酰亚胺树脂:polyimideresin 8、双马来酰亚胺三嗪树脂:bismaleimide-triazineresin 9、丙烯酸树脂:acrylicresin 10、三聚氰胺甲醛树脂:melamineformaldehyderesin 11、多官能环氧树脂:polyfunctionalepoxyresin 12、溴化环氧树脂:brominatedepoxyresin 13、环氧酚醛:epoxynovolac 14、氟树脂:fluroresin 15、硅树脂:siliconeresin 16、硅烷:silane 17、聚合物:polymer 18、无定形聚合物:amorphouspolymer 19、结晶现象:crystallinepolamer 20、双晶现象:dimorphism 21、共聚物:copolymer 22、合成树脂:synthetic 23、热固性树脂:thermosettingresin 24、热塑性树脂:thermoplasticresin 25、感光性树脂:photosensitiveresin 26、环氧当量:weightperepoxyequivalent(WPE) 27、环氧值:epoxyvalue 28、双氰胺:dicyandiamide 29、粘结剂:binder 30、胶粘剂:adesive 31、固化剂:curingagent 32、阻燃剂:flameretardant 33、遮光剂:opaquer 34、增塑剂:plasticizers 35、不饱和聚酯:unsatuiatedpolyester 36、聚酯薄膜:polyester 37、聚酰亚胺薄膜:polyimidefilm(PI) 38、聚四氟乙烯:polytetrafluoetylene(PTFE) 39、聚全氟乙烯丙烯薄膜:perfluorinatedethylene-propylenecopolymerfilm(FEP) 40、增强材料:reinforcingmaterial 41、玻璃纤维:glassfiber 42、E玻璃纤维:E-glassfibre 43、D玻璃纤维:D-glassfibre 44、S玻璃纤维:S-glassfibre 45、玻璃布:glassfabric 46、非织布:non-wovenfabric 47、玻璃纤维垫:glassmats 48、纱线:yarn 49、单丝:filament 50、绞股:strand 51、纬纱:weftyarn 52、经纱:warpyarn 53、但尼尔:denier 54、经向:warp-wise 55、纬向:weft-wise,filling-wise 56、织物经纬密度:threadcount 57、织物组织:weavestructure 58、平纹组织:plainstructure 59、坏布:greyfabric 60、稀松织物:wovenscrim 61、弓纬:bowofweave 62、断经:endmissing 63、缺纬:mis-picks 64、纬斜:bias 65、折痕:crease 66、云织:waviness 67、鱼眼:fisheye 68、毛圈长:featherlength 69、厚薄段:mark 70、裂缝:split 71、捻度:twistofyarn 72、浸润剂含量:sizecontent 73、浸润剂残留量:sizeresidue 74、处理剂含量:finishlevel 75、浸润剂:size 76、偶联剂:couplintagent 77、处理织物:finishedfabric 78、聚酰胺纤维:polyarmidefiber 79、聚酯纤维非织布:non-wovenpolyesterfabric 80、浸渍绝缘纵纸:impregnatinginsulationpaper 81、聚芳酰胺纤维纸:aromaticpolyamidepaper 82、断裂长:breakinglength 83、吸水高度:heightofcapillaryrise 84、湿强度保留率:wetstrengthretention 85、白度:whitenness 86、陶瓷:ceramics 87、导电箔:conductivefoil 88、铜箔:copperfoil 89、电解铜箔:electrodepositedcopperfoil(EDcopperfoil) 90、压延铜箔:rolledcopperfoil 91、退火铜箔:annealedcopperfoil 92、压延退火铜箔:rolledannealedcopperfoil(RAcopperfoil) 93、薄铜箔:thincopperfoil 94、涂胶铜箔:adhesivecoatedfoil 95、涂胶脂铜箔:resincoatedcopperfoil(RCC) 96、复合金属箔:compositemetallicmaterial 97、载体箔:carrierfoil 98、殷瓦:invar 99、箔(剖面)轮廓:foilprofile 100、光面:shinyside 101、粗糙面:matteside 102、处理面:treatedside 103、防锈处理:stainproofing 104、双面处理铜箔:doubletreatedfoil 四、设计 1、原理图:shematicdiagram 2、逻辑图:logicdiagram 3、印制线路布设:printedwirelayout 4、布设总图:masterdrawing 5、可制造性设计:design-for-manufacturability 6、计算机辅助设计:computer-aideddesign.(CAD) 7、计算机辅助制造:computer-aidedmanufacturing.(CAM) 8、计算机集成制造:computerintegratmanufacturing.(CIM) 9、计算机辅助工程:computer-aidedengineering.(CAE) 10、计算机辅助测试:computer-aidedtest.(CAT) 11、电子设计自动化:electricdesignautomation.(EDA) 12、工程设计自动化:engineeringdesignautomaton.(EDA2) 13、组装设计自动化:assemblyaidedarchitecturaldesign.(AAAD) 14、计算机辅助制图:computeraideddrawing 15、计算机控制显示:computercontrolleddisplay.(CCD) 16、布局:placement 17、布线:routing 18、布图设计:layout 19、重布:rerouting 20、模拟:simulation 21、逻辑模拟:logicsimulation 22、电路模拟:circitsimulation 23、时序模拟:timingsimulation 24、模块化:modularization 25、布线完成率:layouteffeciency 26、机器描述格式:machinedescriptionmformat.(MDF) 27、机器描述格式数据库:MDFdatabse 28、设计数据库:designdatabase 29、设计原点:designorigin 30、优化(设计):optimization(design) 31、供设计优化坐标轴:predominantaxis 32、表格原点:tableorigin 33、镜像:mirroring 34、驱动文件:drivefile 35、中间文件:intermediatefile 36、制造文件:manufacturingdocumentation 37、队列支撑数据库:queuesupportdatabase 38、元件安置:componentpositioning 39、图形显示:graphicsdispaly 40、比例因子:scalingfactor 41、扫描填充:scanfilling 42、矩形填充:rectanglefilling 43、填充域:regionfilling 44、实体设计:physicaldesign 45、逻辑设计:logicdesign 46、逻辑电路:logiccircuit 47、层次设计:hierarchicaldesign 48、自顶向下设计:top-downdesign 49、自底向上设计:bottom-updesign 50、线网:net 51、数字化:digitzing 52、设计规则检查:designrulechecking 53、走(布)线器:router(CAD) 54、网络表:netlist 55、计算机辅助电路分析:computer-aidedcircuitanalysis 56、子线网:subnet 57、目标函数:objectivefunction 58、设计后处理:postdesignprocessing(PDP) 59、交互式制图设计:interactivedrawingdesign 60、费用矩阵:costmetrix 61、工程图:engineeringdrawing 62、方块框图:blockdiagram 63、迷宫:moze 64、元件密度:componentdensity 65、巡回售货员问题:travelingsalesmanproblem 66、自由度:degreesfreedom 67、入度:outgoingdegree 68、出度:incomingdegree 69、曼哈顿距离:manhattondistance 70、欧几里德距离:euclideandistance 71、网络:network 72、阵列:array 73、段:segment 74、逻辑:logic 75、逻辑设计自动化:logicdesignautomation 76、分线:separatedtime 77、分层:separatedlayer 78、定顺序:definitesequence 五、形状与尺寸: 1、导线(通道):conduction(track) 2、导线(体)宽度:conductorwidth 3、导线距离:conductorspacing 4、导线层:conductorlayer 5、导线宽度/间距:conductorline/space 6、第一导线层:conductorlayerNo.1 7、圆形盘:roundpad 8、方形盘:squarepad 9、菱形盘:diamondpad 10、长方形焊盘:oblongpad 11、子弹形盘:bulletpad 12、泪滴盘:teardroppad 13、雪人盘:snowmanpad 14、V形盘:V-shapedpad 15、环形盘:annularpad 16、非圆形盘:non-circularpad 17、隔离盘:isolationpad 18、非功能连接盘:monfunctionalpad 19、偏置连接盘:offsetland 20、腹(背)裸盘:back-bardland 21、盘址:anchoringspaur 22、连接盘图形:landpattern 23、连接盘网格阵列:landgridarray 24、孔环:annularring 25、元件孔:componenthole 26、安装孔:mountinghole 27、支撑孔:supportedhole 28、非支撑孔:unsupportedhole 29、导通孔:via 30、镀通孔:platedthroughhole(PTH) 31、余隙孔:accesshole 32、盲孔:blindvia(hole) 33、埋孔:buriedviahole 34、埋/盲孔:buried/blindvia 35、任意层内部导通孔:anylayerinnerviahole(ALIVH) 36、全部钻孔:alldrilledhole 37、定位孔:toalinghole 38、无连接盘孔:landlesshole 39、中间孔:interstitialhole 40、无连接盘导通孔:landlessviahole 41、引导孔:pilothole 42、端接全隙孔:terminalclearomeehole 43、准表面间镀覆孔:quasi-interfacingplated-throughhole 44、准尺寸孔:dimensionedhole 45、在连接盘中导通孔:via-in-pad 46、孔位:holelocation 47、孔密度:holedensity 48、孔图:holepattern 49、钻孔图:drilldrawing 50、装配图:assemblydrawing 51、印制板组装图:printedboardassemblydrawing 52、参考基准:datumreference |