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Career Opportunity with a world class MNC......

美新半导体（无锡）有限公司是一家典型的从零开始创业成功的高科技半导体企业。公司成立于一九九九年十一月，其核心技术主要来源于创始人员及美国模拟器件公司（ADI）的技术投资；其资金来源于美国，加拿大，台湾等地的风险投资，如台湾的积体半导体公司TSMC（其风险投资公司INVESTAR），Celtic, Still River等。公司是全中国及全亚洲唯一的具备商业量产化以及最严格的质量管理体系的MEMS产品公司。公司生产的二十多种型号的加速度计传感器集成电路处于世界最领先水平, 公司成为众多世界知名厂家的合格供应商，如IBM，SONY（索尼），Panasonic（松下），NEC, Toshiba, Autoliv(欧洲著名汽车电子系统商，美国通用，法标的重要电子供应商之一)。历年来，公司获得多项海外荣誉，被美国著名半导体媒体 Silicon Strategies评为世界60家最具潜质的新兴半导体公司之一。

美新半导体（无锡）有限公司现处于高速发展阶段, 将以广阔的个人发展空间、高度灵活的用人机制、极具竞争力的薪酬待遇，真诚欢迎人才加盟,共同锻造美新的辉煌！

1. IC Designer Engineer

Requirements:

-Master of Science in Electrical Engineering, IC design emphasis, with over 2 years experience. PHD is highly desirable.
-Proficiency in using EDA tools.
-Sound knowledge of IC fabrication process, layout and design methodology.
-Good written and spoken English and able to work both independently and in a team.
-Self-motivated with the ability to achieve results.

-Knowledge in Mixed-Signal products.

Responsibilities

-Perform mixed signal IC design, layout and simulation

-Involved in product definition

-Work with product & testing engineers for FMEA

-Interface with mask making and wafer foundry.

2. Senior IC Packaging Engineer

Requirements:

-PHD or Ms in physics, materials science, mechanics and electronical engineering

-Min 3 years experience on microelectronic packaging

-Familiar with a broad range of packaging fields including hermetic sealing, flip-chip. MCN, wafer level bonding, BGA, optical packaging etc.

-Strong theoretical background in materials and microelectronic packaging principles.

-Proficient in English, spoken and written.

3. Senior Design Engineer

Requirements:

-PHD or Ms in physics, electronical engineering or mechanics

-Min 3 years research experience in MEMS design

-Proficient in MEMS CAD design tools, such as MEM CAD ANSYS and Matlab

-Practical experience in IC design, IC or MEMS fabrication is preferred.

符合条件的应聘者, 请将您的求职简历email至memsic_hr@memsic.com,或访问我公司网站www.memsic.com